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Year Title Metal Oxide Anneal.    
             
2013

KHU Suwon

Correlation between Ti source/drain contact and performance of InGaZnO-based thin film transistors Ti

Evaoiration

Thick. 50 nm
In:Ga:Zn:O 1:1:1
Depo. DC Sputt.
Temp. RT
Gas O2/Ar=0.015
Pressure 2mTorr
Power 2.2W/cm2
P.Ann. 300C, 1h, Air
   
2013

SKKU

Thermal stability of metal Ohmic contacts in indium gallium zinc oxide transistors using a graphene barrier layer  
Thick. 60 nm
In:Ga:Zn:O 1:1:1
Depo. rfSputt.
Temp. RT
Gas  
Pressure  
Power  
P.Ann. 350C, 1h, Air
250 C, 5min 3cycle 열처리 후 AlOx두께 증가 7~8nm

2012

SKKU

Electrical effect of titanium diffusion on amorphous indium gallium zinc oxide Ti IGZO

IGZO

Thickness 200 nm
In:Ga:Zn:O  
Depo. DC Sputt.
Temp.  
Gas  
Pressure  
Power  
P.Ann.  

PECVD SiOx passivation

 

 

Equip. Convection Oven
Temp 250C,300C,

350C

Time 1h
Heating rate  
Ambient Air
Pressure AP
Relative quantities of the equilibrium phase calculated by HSC thermodynamics simulation program as a function of annealing temperature,

Ti and In are most likely to be oxidized and reduced, respectively, at 0 C–400 C.

 

 

2012

SNU

Effects of metal electrode on the electrical performance of amorphous In-Ga-Zn-O thin film transistor Mo

Al

Cu/Mo(200nm)

DC sputter, RT, Ar 4mTorr, 50W

IGZO 250 C, 1h, air  
 
No Ann.