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| ¡¡ | SOG Á¤¸® | ||||||
| SOG | Spin on glass: Si-O network polymers in organic
solvents, Silanol compound¿Í Solvent°¡ È¥ÇյǾî ÀÖ´Â ¾×ü ¿ë¾×
[ Silanol compound : RnSi(OH)4n ] + Solvent |
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| º¸°ü | ³ÃÀå º¸°ü, »ç¿ë½Ã ²¨³» »ó¿Â¿¡¼ »ç¿ë | ||||||
| Á¦Á¶ | TEOS (tetraetoxysilane) À»
Hydrolysis (°¡¼ö ºÐÇØ:¹°À» ÷°¡ÇÏ¿© ºÐÇØ) ¹æ¹ýÀ¸·Î Á¦Á¶
Si(OC2H5)4), water (H2O) , isopropanol ((CH5)2CH(OH)) and hydrochloric
acid (HCl). Because TEOS and water are immiscible, the reactions
only begin when the solvent
even with excess water (r >> 2), the reaction does not
go to completion. The final product (silicate SOG) will be a transparent
sol of organic solvents (ethanol, ¡¡ ¡¡ |
Synonym: Orthosilicic
acid tetraethyl ester, TEOS, Tetraethoxysilane
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| ¡¡ | Æ®¸®¿¡Åå½Ã½Ç¶õ+ºñ½ºÆ®¸®¸ÞÅå½Ã½Ç¸±¿¡ÅºÀ»
(8:2 ȤÀº 9.5:0.5 ¸ôºñ) °¡¼ö ºÐÇØ
Æú¸®¿¡Å׸£ ½Ç·Ï»ê °øÁßÇÕü¸¦ ´õ Æ÷ÇÔÇÏ´Â °ÍÀÌ ¹Ù¶÷Á÷ÇÏ´Ù.(0.1~5.0 wt %) À¯±â ¿ë¸Å·Î ¸ÞÆ¿ÀÌ¼ÒºÎÆ¿ÄÉÅæÀ» »ç¿ëÇÒ ¼ö ÀÖ´Ù. |
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| ¡¡ | ½Ç½Ã¿¹ 1 : º» ¹ß¸íÀÇ Àý¿¬¸· Çü¼º¿ë Á¶¼º¹°ÀÇ
Á¦Á¶ Æ®¸®¿¡Åå½Ã½Ç¶õ 10.15g, ¸ÞÆ¿ÀÌ¼ÒºÎÆ¿ÄÉÅæ 10g, Áú»ê/¹°(0.0006% ¼ö¿ë¾×) 1.2g ¹× ¹° 1.2gÀ» 50ml Çöó½ºÅ©¿¡ Ī·®ÇÑÈÄ, È¥ÇÕÇÏ¿© 30 ºÐ°£ ±³¹ÝÇÏ¿´´Ù. »ó±â ¹ÝÀÀ È¥ÇÕ¹°ÀÇ ¿Âµµ¸¦ »ó¿ÂÀ¸·Î ³Ã°¢ÇÑ ÈÄ, ÀÌ·¯ÇÑ ¹ÝÀÀ È¥ÇÕ¹°¿¡ ºñ½ºÆ®¸®¸ÞÅå½Ã½Ç¸±¿¡Åº 1.85g ¹× ¸ÞÆ¿ÀÌ¼ÒºÎÆ¿ÄÉÅæ 5.56gÀ» ¾à 10 ºÐ¿¡ °ÉÃÄ ÅõÀÔÇϰí, 3 ½Ã°£ µ¿¾È ´Ù½Ã ±³¹ÝÇÏ¿´´Ù. ÀÌ·¯ÇÑ °úÁ¤À» ÅëÇØ ½Ç½Ã¿¹ 1ÀÇ Àý¿¬¸· Çü¼º¿ë Á¶¼º¹°À» Á¦Á¶ÇÏ¿´´Ù. ¡¡ ½Ç½Ã¿¹ 2 : º» ¹ß¸íÀÇ Àý¿¬¸· Çü¼º¿ë Á¶¼º¹°ÀÇ Á¦Á¶
Á¾·¡ ±â¼ú
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| Ư¡ | SOG ÀÇ ÆòźÈ
Ư¼º, ±â°èÀû ¹°¼º ¹× µµÆ÷¼º µîÀº, Æ÷ÇÔµÈ À¯±â ¿ë¸ÅÀÇ Á¾·ù¿Í
½Ç¸®ÄÜ ÈÇÕ¹°ÀÇ ºÐÀÚ·® ¹× ºÐÀÚ·® ºÐÆ÷¿¡ µû¶ó ¸¹ÀÌ Á¿ìµÈ´Ù. |
ºÐÀÚ·®ÀÌ Áö³ªÄ¡°Ô
³·Àº °æ¿ì: »ó´ëÀûÀ¸·Î ¹Ðµµ°¡ ³·Àº Àý¿¬¸·ÀÌ Çü¼ºµÇ¾î, Àý¿¬¸·ÀÇ ±â°èÀû ¹°¼ºÀÌ ÀúÇϵǴ µ¿½Ã¿¡, ½ºÇÉ ÄÚÆÃ ÈÄÀÇ
º£ÀÌÅ·½Ã¿¡ ±Õ¿¿¡ ´ëÇÑ ÀúÇ×¼ºÀÌ ³·¾ÆÁø´Ù.
ºÐÀÚ·® ºÐÆ÷°¡ ³Ð¾îÁú¼ö·Ï, Àý¿¬¸· ³»ÀÇ ÀÔÀÚ¿Í ÀÔÀÚ »çÀ̰¡ Ä¡¹ÐÇÏ°Ô Ã¤¿öÁüÀ¸·Î¼, ÆòźȰ¡°ø µî¿¡ ÀÇÇÑ ¿µÇâ ÀÚü°¡ ÃÖ¼ÒȵǾî Àý¿¬¸·ÀÇ ÆòÅºÈ Æ¯¼ºÀÌ Çâ»óµÇ¸ç, Àý¿¬¸·ÀÌ »ê ¶Ç´Â ¿°±â µî¿¡ ´ëÇØ¼µµ °ÇÑ ÀúÇ×¼ºÀ» °¡Áö°Ô µÇ°í, ¹Ðµµ°¡ Å« Àý¿¬¸·ÀÌ Çü¼ºµÇ¾î Àý¿¬¸·ÀÇ ±â°èÀû ¹°¼ºÀÌ Çâ»óµÈ´Ù |
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| °øÁ¤ | Coating | Á¡µµ¿Í ½ºÇÉ ¼Óµµ·Î µÎ²² Á¶Àý | |||||
| ¡¡ | Bake | For the purpose of out-gassing, the drying temperature should be approximately 250 oC. | |||||
| ¡¡ | Cure | To go from sticky gel to a hard gel usually takes about
30 minutes at temperatures less than 600 oC, Water and
solvent evaporate through interconnected pores which remain open at the
surface. The micro porosity in silica is not removed entirely until 1000 oC, but it may already behave as an oxidation barrier or passivation coating at 600 oC. This ability of the micro-porous film to behave in many ways like the bulk oxide is an attractive property of the sol-gel approach to coating. |
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| ¡¡ | ¡¡ | ||||||
| Silicate based SOG |
Silanol (Si-OH) compound¿¡ CH3 ±âÀÇ Á¸Àç À¯¹«¿¡ µû¶ó Silicate¿Í Siloxane °è·Î ³ª´©¾î Áö´Âµ¥ CH3 ±â °¡ ¾ø´Â °æ¿ì´Â silicate °èÀÌ´Ù. The silicate SOG is formed from a condensation reaction of Si(OH)4 by losing water. When the film is fully cured, the film should form a strong Si-O network and contain no -OH but it has fairly significant shrinkage. |
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| Organosilicon SOG (Siloxane SOG) |
Siloxane type SOG´Â Si ¿øÀÚ¿¡ Silanol group°ú Methyl group(-CH3)ÀÌ °áÇÕ. Siloxane°è´Â Silicate°è¿¡ ºñÇØ Á¡µµ°¡ Ä¿¼ µµÆ÷ ÈÄ¿¡ Æòźµµ°¡ ¿ì¼öÇϰí Methyl groupÀ» ÇÔÀ¯Çϰí Àֱ⠶§¹®¿¡ bakingÇÏ´Â °úÁ¤¿¡¼ ¸·ÀÇ ¼öÃàÀ» ¸·À» ¼ö ÀÖÀ¸¸ç ÀÌ·Î ÀÎÇÑ stressµµ ÀÛ¾Æ ¸·ÀÇ CrackÀÇ ÀúÇ×¼ºÀÌ Å©´Ù´Â ÀåÁ¡,
contains –CH3 or –C2H5
types of organic dopants. the organic group modifies the Si-O
network which lowers the film stress to 200 MPa, typically. The
viscosity and molecular weight are slightly higher than that of the
silicate SOG. The film is thicker than that of the silicate SOG using
the It has been observed that some of the siloxane SOG films pick up atmospheric water and this may become a reliability issue or cause extensive processing constraints. It can be seen from the FTIR spectra before and after 400 oC baking that Si-OR and Si-R (R stand for organic groups) peaks disappear and Si-OH peaks show up. The - OH content not only reduces the device performance (due to high dielectric constant) but also creates reliability issues. Increasing the organic content will further reduce the film stress and improve the crack resistance and planarity. |
SPIN-ON GLASS MATERIALS AND APPLICATIONS IN ADVANCED IC TECHNOLOGIES
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| Àý¿¬Àç·á | Siloxane °è°¡ Film³» CarbonÀÌ O2¿Í ¹ÝÀÀÇÏ´Â ÀÌÀ¯·Î Silicate °è¿¡ ºñÇØ ¼öÃàÀÌ Å©´Ù. ¶ÇÇÑ 420¡É/30ºÐ Anneal ÈÄ¿¡ H2O¿Í CH3¿Í °°Àº À¯±â¹°ÀÌ ¹ß°ßµÇÁö ¾Ê¾Æ ÃÖ¼ÒÇÑ 420¡É Á¤µµÀÇ CuringÀÌ ÇÊ¿äÇÏ´Ù. Siloxane °è Silicate °è N2 ºÐÀ§±â 10.7% 20.5% O2 ºÐÀ§±â 14.4% 19.9% |
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| ¿ë¾×°øÁ¤À¸·Î °¸ÇÊ °¡´É °øÁ¤. ¾Æ·¡±×¸²°ú °°ÀÌ ±íÀº ÄÁÅÃÀ» ä¿ì°í ÆòÅºÈ ±â´É. Á¼°í ±íÀº ÄÁÅÿ¡ PECVD
µîÀ¸·Î ÁõÂø ÇÏ¸é ¿À¸¥ÂÊ ±×¸²°ú °°ÀÌ void°¡ »ý±æ ¼ö ÀÖÀ½
¡¡ ¡¤ÀåÁ¡ : Liquid sourceÀÇ Coating ÇüÅ·ΠÆòÅÁÈ È¿°ú°¡ ¶Ù¾î³ª°í, ºñ¿ëÀÌ Àú·Å. |
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| ¡¡ |
OH
OH | | OH - Si - OH + O = X - OR + Solvent SOLUTION | | OH OH |
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| ¡¡ |
O OH
OH | | | O - Si - O - Si - O + O = X - OR POROUS | | | OH O OH (After Spinning ¡ 150¡É) |
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| ¡¡ |
O O O O | | ¡« | O - Si - O - Si - O - X - O - Si - O - GLASSY | | | | O O O O (Heated at 250¡É ¡ 350¡É) | | | - Si - OR - Si - | | |
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| ¡¡ |
O O O O | | ¡« | O - Si - O - Si - O - X - O - Si - O - INORGANIC | | | | O O O O (Heated at 350¡É ¡ 600¡É) | | | | O - Si - O - Si - O - X - O - Si - O - | | | | O O O O | | | | O - Si - O - X - O - Si - | ¡« O O |
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| ¡¡ | ¡¡ | ||||||
| ¡¡ | ¡¡ | ||||||
| Àç·á | ³×ÆÐ½º SOG Cospeen-1225G ³×ÆÐ½º ƯÇã Cospeen-1225G is methyl-siloxane-based organic spin-on-glass coating solution |
• Planarization > 90% at 1 ¥ìm feature • Coating thickness 2300 ¡Ê - 4000 ¡Ê per coat • Bake temperature / time 80oC / 2 min - 230oC / 4 min • Cure temperature / time 450oC / 30 min in N2 |
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| Âü°í¹®Çå | SPIN-ON GLASS MATERIALS AND APPLICATIONS IN ADVANCED IC TECHNOLOGIES | ||||||